Investigating TP-AFP process parameters through a mechanical testing approach

Investigating TP-AFP process parameters through a mechanical testing approach

IANNONE Vincenzo, DE NICOLA Felice, COSTANTINI Mario, GIUSTO Giovangiuseppe, CARLONE Pierpaolo

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Abstract. The present work investigates a non-standard approach for tuning TP-AFP process parameters, employing an in-house-designed setup for CF/PEEK ring coupons production and mechanical testing to assess interlaminar shear strength (ILSS). The TP-AFP setup features a laying head based on hot gas torch heating source, controlled pressure on a compaction roller, IR thermal monitoring, all operated by a six-degrees-of-freedom (DOF) robotic anthropomorphic arm. Through a non-standard split-disk setup, ILSS is thus evaluated, with its relation with key process parameters such as laydown speed, pressure, and temperature investigated. Although there is a high scatter level of the mechanical characterization parameters of the specimens, the analysis highlights how there is a direct dependence between the AFP process parameters – especially the temperature – and the ILSS values calculated through the split-disk testing carried out.

Keywords
TP-AFP, Advanced Manufacturing, Process Optimization, Mechanical Testing, ILSS, Composite, Forming

Published online 4/24/2024, 8 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: IANNONE Vincenzo, DE NICOLA Felice, COSTANTINI Mario, GIUSTO Giovangiuseppe, CARLONE Pierpaolo, Investigating TP-AFP process parameters through a mechanical testing approach, Materials Research Proceedings, Vol. 41, pp 595-602, 2024

DOI: https://doi.org/10.21741/9781644903131-66

The article was published as article 66 of the book Material Forming

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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