A feasibility study to improve the processability of pure copper produced via laser powder bed fusion process

A feasibility study to improve the processability of pure copper produced via laser powder bed fusion process

Abdollah Saboori, Marta Roccetti Campagnoli, Manuela Galati, Flaviana Calignano, Luca Iuliano

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Abstract. Additive Manufacturing (AM) refers to a family of layer-upon-layer building technologies capable of producing geometrically intricate parts in a single step. Today, the processability of many materials through AM is under development. One of the most interesting studies is the production of copper parts via laser-based technologies. Unluckily, mainly due to the high thermal conductivity and reflectivity of copper, its processability through AM processes is particularly challenging. Thus, in this research, a new material-based solution is proposed to improve the processability of copper through laser powder bed fusion. Therefore, a single scan track analysis is performed on pure copper and mixtures of copper/graphite. The outcomes show that adding graphite could increase copper’s laser absorption and processability.

Additive Manufacturing, Copper, Processability, Laser Powder Bed Fusion, Single Scan Tracks

Published online 9/5/2023, 9 pages
Copyright © 2023 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Abdollah Saboori, Marta Roccetti Campagnoli, Manuela Galati, Flaviana Calignano, Luca Iuliano, A feasibility study to improve the processability of pure copper produced via laser powder bed fusion process, Materials Research Proceedings, Vol. 35, pp 393-401, 2023

DOI: https://doi.org/10.21741/9781644902714-47

The article was published as article 47 of the book Italian Manufacturing Association Conference

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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