Polycrystalline Material, Yield Condition, Damage Process, Self-Consistent Model, Diffraction Measurements

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Diffraction Methods and Scale Transition Model used to study Evolution of Intergranular Stress and Micro-Damage Phenomenon during Elasto-Plastic Deformation

A. Baczmański, S. Wroński, E. Gadalińska, Y. Zhao, L. Le Joncour, C. Braham, C. Scheffzük, P. Kot

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A methodology combining diffraction experiments and self-consistent calculations was used to study the mechanical behaviour of groups of grains within two-phase polycrystalline materials. In this work, an Al/SiCp composite and duplex austenitic-ferritic steel are studied. The lattice strain evolution was determined from lattice strain measured in situ during tensile tests using neutron diffraction. The experimental results were used to study slip on crystallographic planes, localisation of stresses in polycrystalline grains and the mechanical effects of damage occurring during plastic deformation. For this purpose, a prediction made using the recently developed new version of the elasto-plastic self-consistent model was compared with the experimental data.

Keywords
Polycrystalline Material, Yield Condition, Damage Process, Self-Consistent Model, Diffraction Measurements

Published online 4/20/2018, 6 pages
Copyright © 2018 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: A. Baczmański, S. Wroński, E. Gadalińska, Y. Zhao, L. Le Joncour, C. Braham, C. Scheffzük, P. Kot, ‘Diffraction Methods and Scale Transition Model used to study Evolution of Intergranular Stress and Micro-Damage Phenomenon during Elasto-Plastic Deformation’, Materials Research Proceedings, Vol. 4, pp 3-8, 2018

DOI: http://dx.doi.org/10.21741/9781945291678-1

The article was published as article 1 of the book

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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