Progression of plastic die deformation during copper extrusion

Progression of plastic die deformation during copper extrusion

LECHNER Stefan, MÜLLER Sören

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Abstract. In copper extrusion, the dies are continuously subjected to high thermo-mechanical stress. This results in elastic and plastic die deformation as well as extensive wear. To estimate the strain of possible hard phase surface modifications during service, knowledge of the deformation behavior of the extrusion dies is required. Therefore, the plastic deformation of dies made of four different tool materials was investigated in the present study. The applied tool materials were hot-work tool steel 1.2367, special hot-work tool steel CS1, nickel-based alloy 2.4668 (Alloy 718) and cobalt-based alloy 2.4775 (Stellite 1). 3D scans of the dies were created, both in the initial state and after each of three extrusion cycles, utilizing structured-light scanning. The extrusion trials were carried out using an 8MN extrusion press configured for direct extrusion and billets made of commercially pure copper Cu-DHP (CW024A). By evaluation of the 3D scans, the progression of plastic die deformation was determined in dependence on the tool material. Finally, the results were compared to corresponding numerical investigations on die deformation.

Keywords
Copper Extrusion, Plastic Die Deformation, 3D Scanning, Numerical Analysis

Published online 4/19/2023, 10 pages
Copyright © 2023 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: LECHNER Stefan, MÜLLER Sören, Progression of plastic die deformation during copper extrusion, Materials Research Proceedings, Vol. 28, pp 523-532, 2023

DOI: https://doi.org/10.21741/9781644902479-57

The article was published as article 57 of the book Material Forming

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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