Polymer-tool friction coefficient in temperature for thermoforming numerical simulation
CAUBET Benoit, LÉONARDI Frederic, AMAND Sylvain
download PDFAbstract. In this work, friction coefficient between Polycarbonate and Aluminum was measured over the entire thermoforming temperature range by using a rotational rheometer with a specific geometry, following the B. Hegemann et al. [1] method. The effects of velocity, pressure and surface roughness were investigated. Then, numerical simulation were performed using a finite element code package for thermoforming (T-SIM®) with K-BKZ viscoelastic model. The objective of this work is to find which friction coefficient use in T-SIM simulation to be as close as possible to reality. For this, numerical simulation results for different friction coefficient were compared with experimental values to evaluate the predictive capacity. It was shown that friction coefficient is temperature dependent and rapidly increase above glass transition of polycarbonate. At room temperature, friction coefficient increases with an increase in roughness, but after glass transition, trend is reversed. Simulations with measured friction coefficients shows good agreement with experiment data.
Keywords
Thermoforming, Friction Coefficient, Numerical Simulation, Thickness Distribution, T-SIM®, Polycarbonate
Published online 4/19/2023, 10 pages
Copyright © 2023 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: CAUBET Benoit, LÉONARDI Frederic, AMAND Sylvain, Polymer-tool friction coefficient in temperature for thermoforming numerical simulation, Materials Research Proceedings, Vol. 28, pp 1907-1916, 2023
DOI: https://doi.org/10.21741/9781644902479-206
The article was published as article 206 of the book Material Forming
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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