Dislocation Density of Oxygen Free Copper with Compressive Strain Applied at High Temperature

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Dislocation Density of Oxygen Free Copper with Compressive Strain Applied at High Temperature

M. Sano, S. Takahashi, A. Watanabe, A. Shiro, T. Shobu

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Dislocation densities of oxygen-free copper (OFC) with compressive strain applied at high temperatures were examined by X-ray line profile analyses with synchrotron radiation. To evaluate the dislocation density, we applied the modified Williamson-Hall and modified Warren-Averbach methods. The dislocation densities of OFC with compressive strain ranging from 0.9 – 3.8 % were on the order of 1.2×1013 – 4.2×1014 m-2.

Keywords
Dislocation Density, OFC, Plastic Strain, Line Profile Analysis

Published online 4/20/2018, 6 pages
Copyright © 2018 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: M. Sano, S. Takahashi, A. Watanabe, A. Shiro, T. Shobu, ‘Dislocation Density of Oxygen Free Copper with Compressive Strain Applied at High Temperature’, Materials Research Proceedings, Vol. 4, pp 37-42, 2018

DOI: http://dx.doi.org/10.21741/9781945291678-6

The article was published as article 6 of the book

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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