Measurement of Residual Stresses in Different Thicknesses of Laser Shock Peened Aluminium Alloy Samples
S.N van Staden, C. Polese, D. Glaser, J.-P. Nobre, A.M. Venter, D. Marais, J. Okasinski, J.-S. Park
download PDFThis study focused on depth-resolved residual stress results determined with a number of complementary techniques on Laser Shock Peening (LSP) treated aluminium alloy 7075-T651 samples with different thicknesses (6 mm and 1.6 mm). Samples were prepared from a single commercially produced rolled plate that was then treated with LSP. Residual stresses were measured using Laboratory X-Ray Diffraction (LXRD), Incremental Hole Drilling (IHD), Neutron Diffraction (ND) and Synchrotron XRD (SXRD). The LSP treatment resulted in the establishment of compressive residual stresses that varied rapidly in the near surface region. The compressive stresses extended up to 1.5 mm in depth in the 6 mm thick sample. Some surface stress relaxation was observed in the first 25 μm, but substantially large stresses existed at 50 μm. This investigation strongly motivated why residual stress profiles should be obtained using a variety of techniques.
Keywords
Laser Shock Peening, Aluminium, Residual Stress, Incremental Hole Drilling, X-ray Diffraction, Synchrotron, Energy-Dispersive, Neutron Diffraction
Published online 4/20/2018, 6 pages
Copyright © 2018 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: S.N van Staden, C. Polese, D. Glaser, J.-P. Nobre, A.M. Venter, D. Marais, J. Okasinski, J.-S. Park, ‘Measurement of Residual Stresses in Different Thicknesses of Laser Shock Peened Aluminium Alloy Samples’, Materials Research Proceedings, Vol. 4, pp 117-122, 2018
DOI: http://dx.doi.org/10.21741/9781945291678-18
The article was published as article 18 of the book
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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