Residual Stresses 2016

In-situ Monitoring of Laser Surface Line Hardening by Means of Synchrotron X-Ray Diffraction

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In-situ Monitoring of Laser Surface Line Hardening by Means of Synchrotron X-Ray Diffraction

D. Kiefer, J. Gibmeier, F. Beckmann, F. Wilde

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Abstract. An in-situ X-ray diffraction investigation of a power controlled laser line hardening experiment has been carried out at the synchrotron beamline P05 at the German electron synchrotron (DESY) in Hamburg. During the process the local strain and stress evolution is monitored using synchrotron radiation with a time resolution of 10 Hz. Samples made of steel grade AISI 4140 were line hardened by means of a high-power diode laser (HPDL) unit at constant laser feed. A specially designed process chamber was used, allowing the control of the inert gas atmosphere to avoid oxide scale formation. Through the symmetric application of 4 fast micro-strip line detectors various {hkl} diffraction lines were recorded during the short-time heat treatment by means of the single exposure approach. Thermal and elastic strains were separated and time resolved stress analysis was carried out according to the sin2ψ-method. Stress and strain evaluation during the complete laser hardening process lead to unprecedented experimental insights.

Keywords
in-situ X-Ray Stress Analysis, Synchrotron X-Ray Diffraction, Laser Surface Hardening, Real Time Monitoring

Published online 12/22/2016, 6 pages
Copyright © 2016 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: D. Kiefer, J. Gibmeier, F. Beckmann, F. Wilde, ‘In-situ Monitoring of Laser Surface Line Hardening by Means of Synchrotron X-Ray Diffraction’, Materials Research Proceedings, Vol. 2, pp 467-472, 2017

DOI: http://dx.doi.org/10.21741/9781945291173-79

The article was published as article 79 of the book Residual Stresses 2016

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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