Tensile Residual Stress Mitigation Using Low Temperature Phase Transformation Filler Wire in Welded Armor Plates
X. YU, D. TZELEPIS, J. BUNN, A.E. PAYZANT, Z. FENGdownload PDF
Abstract. Hydrogen induced cracking (HIC) has been a persistent issue in welding of high-strength steels. Mitigating residual stresses is one of the most efficient ways to control HIC. The current study develops a proactive in-process weld residual stress mitigation technique, which manipulates the thermal expansion and contraction sequence in the weldments during welding process. When the steel weld is cooled after welding, martensitic transformation will occur at a temperature below 400 °C. Volume expansion in the weld due to the martensitic transformation will reduce tensile stresses in the weld and heat affected zone and in some cases produce compressive residual stresses in the weld. Based on this concept, a customized filler wire which undergoes a martensitic phase transformation during cooling was developed. The new filler wire shows significant improvement in terms of reducing the tendency of HIC in high strength steels. Bulk residual stress mapping using neutron diffraction revealed reduced tensile and compressive residual stresses in the welds made by the new filler wire.
Hydrogen Induced Cracking, Armor Steel, Residual Stress, Low Temperature Transformation
Published online 12/22/2016, 6 pages
Copyright © 2016 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: X. YU, D. TZELEPIS, J. BUNN, A.E. PAYZANT, Z. FENG, ‘Tensile Residual Stress Mitigation Using Low Temperature Phase Transformation Filler Wire in Welded Armor Plates’, Materials Research Proceedings, Vol. 2, pp 461-466, 2017
The article was published as article 78 of the book Residual Stresses 2016
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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