Measurement of Highly Non-uniform Residual Stress Fields in Thin Plate Using a New Side Cut Destructive Method

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Measurement of Highly Non-uniform Residual Stress Fields in Thin Plate Using a New Side Cut Destructive Method

H.K. Kim, M.J. Pavier, A. Shterenlikht

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Abstract. A recently proposed Mechanical Strain Relaxation (MSR) technique for the measurement of residual stress in thin plates is presented. The measurement of residual stress involves making a single straight cut and collecting the relaxation displacement data from the side surface. In this work the method was applied to an Aluminium friction stir welded (FSW) specimen. The cut was introduced with a wire electrical discharge machining. The displacements were recorded with a 3D digital image correlation (DIC) method. The measured FSW residual stress profile agreed well with that measured by Energy Dispersive X-ray Diffraction (EDXRD). It was observed that the amount of plastic strain, caused by stress redistribution during the relaxation process, strongly depends on the direction of the propagation of the cut. In particular, if a cut is propagated along the thickness of a plate, then the effect of plastic flow on the measured residual stress is negligible. Another attractive feature of the method is that it is relatively insensitive to random experimental noise.

Keywords
Non-uniform Residual Stress, Mechanical Strain Relaxation Technique, Digital Image Correlation, Thin Friction Stir Welding Plate, Plasticity Effect

Published online 12/22/2016, 6 pages
Copyright © 2016 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: H.K. Kima, M.J. Pavierb, A. Shterenlikhtc, ‘Measurement of Highly Non-uniform Residual Stress Fields in Thin Plate Using a New Side Cut Destructive Method’, Materials Research Proceedings, Vol. 2, pp 115-120, 2017

DOI: http://dx.doi.org/10.21741/9781945291173-20

The article was published as article 20 of the book Residual Stresses 2016

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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