Fabrication of Diamond/SiC Composites using HIP from the Mixtures of Diamond and Si Powders

Fabrication of Diamond/SiC Composites using HIP from the Mixtures of Diamond and Si Powders

Ken Hirota, Motoyasu Aoki, Masaki Kato, Minoru Ueda, Yoichi Nakamori

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Abstract. Diamond/SiC=75/25~50/50vol% composites have been fabricated utilizing a liquid-phase reaction sintering during hot isostatic pressing (HIP) at 1450°C under 196 MPa for 2 h from the mixtures of diamond and Si powders. They were mixed for 30 min in ethanol. After drying, they were compacted uniaxially and isostatically (245 MPa). They were pre-heated at 950°C for 2 h (Process I) or solidified using pulsed electric-current pressure sintering (PECPS) at 1350 or 1450°C for 10 min under 50 MPa in a vacuum (Process II). Both compacts prepared via “Process I” or “II” were densified by Pyrex-glass capsule HIPing (1450°C/2h/196MPa/Ar). The high relative density has been achieved at the composition of diamond/SiC=55/45vol% using Process II. In order to increase Vickers hardness (Hv), a small amount of B4C particles have been added to diamond/SiC= 55/45vol% composites using “Process II” at 1350°C and followed by HIP. The Hv values increased from 37.3 to 40.5 GPa at 5vol% B4C addition.

Diamond, SiC, B4C, Liquid-Phase Reaction Sintering, Vickers Hardness

Published online 2/11/2019, 7 pages
Copyright © 2019 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Ken Hirota, Motoyasu Aoki, Masaki Kato, Minoru Ueda, Yoichi Nakamori, Fabrication of Diamond/SiC Composites using HIP from the Mixtures of Diamond and Si Powders, Materials Research Proceedings, Vol. 10, pp 190-196, 2019

DOI: http://dx.doi.org/10.21741/9781644900031-25

The article was published as article 25 of the book Hot Isostatic Pressing

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

[1] F.P. Bundy, H.T. Hall, H.M. Strong, R.H. Wentorf, Jr., Man-Made Diamonds, Nature, 176 (1955) 51-55. https://doi.org/10.1038/176051a0
[2] R. Berman, F. Simon, On the Graphite-Diamond Equilibrium, Zeit. Electrochem., 59, 5 (1950) 333-38.
[3] H. Sumiya, N. Toda, S. Satoh, Growth rate of high-quality large diamond crystals, J. Crystal Growth, 237-239 (2002) 1281-1285. https://doi.org/10.1016/S0022-0248(01)02145-5
[4] S. Kume, K. Suzuki, H. Yoshida, Hot Isostatic Pressing of Diamond-Containing Inorganic Composites, pp. 53-55 in Physical Properties of Composites, Proceedings o 125th TMS Annual Meetings Symposium, The Minerals, Metals and Materials Society, Warrendale, PA, 1996
[5] M. Shimono, S. Kume, HIP-sintered composites of C(diamond)/SiC, J. Am. Ceram. Soc., 87, 4 (2004) 752-55. https://doi.org/10.1111/j.1551-2916.2004.00752.x
[6] M. Tokita, Trend in Advanced SPS Spark Plasma System and Technology, J. Soc. Powder Tech. Jpn., 30 (1993) 790-804. https://doi.org/10.4164/sptj.30.11_790
[7] K. Hirota, Y. Takaura, M. Kato, Y. Miyamoto, Fabrication of Carbon Nanofiber(CNF)-Dispersed Al2O3 Composites by Pulsed Electric-Current Pressure Sintering and their Mechanical and Electrical Properties, J. Mater. Sci.,42[13] (2007) 4792-4800. https://doi.org/10.1007/s10853-006-0830-0
[8] K. Hirota, M. Shima, X. Chen, N. Goto, M. Kato, T. Nishimura, Fabrication of dense B4C/CNF composites having extraordinary high strength and toughness at elevated temperatures, Mater. Sci. Eng. A, 628 (2015) 41-49. https://doi.org/10.1016/j.msea.2015.01.020
[9] S. Yerazunis, J.W. Bartlett, A.H. NIssan, Packing of Binary Mixtures of Spheres and Irregular Particles, Nature, 195 [7] (1962) 33–35. https://doi.org/10.1038/195033a0
[10] J.E. Marion, C.H. Hsueh, A.G. Evans, Liquid-Phase Sintering of Ceramics, J. Am. Ceram. Soc., 70 [10] (1987) 708–713. https://doi.org/10.1111/j.1151-2916.1987.tb04868.x
[11] M.I. Mendelson, Average Grain Size in Polycrystalline Ceramics, J. Am. Ceram. Soc., 52, (1969) 443–446 [6] (2009) 607-616.